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    WB400-A Fully Automated Wafer Bonding Ultrasonic Scanning Equipment.jpg

    WB400-A Fully Automated Wafer Bonding Ultrasonic Scanning Equipment

    The WB400-A is used for 6/8/12-inch wafer inspection, integrating an EFEM wafer loading and unloading system, a motion scanning platform, an ultrasonic scanning system, and a nitrogen drying system to achieve integrated, fully automated ultrasonic scanning testing for wafer inspection.
    Ultrasonic scanning is an indispensable quality control tool in wafer bonding processes. With its unique ability to be non-destructive, highly sensitive, and able to see through internal interfaces, it provides engineers with a "X-ray vision" of bonding interface quality, and is one of the key technologies to ensure wafer bonding yield, improve device reliability, and promote the development of 3D integration technology.

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      Product Description

      The WB400-A is used for 6/8/12-inch wafer inspection, integrating the EFEM wafer loading and unloading system, motion scanning platform, ultrasonic scanning system, and nitrogen drying system to achieve integrated fully automated wafer inspection and ultrasonic scanning testing.
      Ultrasonic scanning is an indispensable quality control tool in wafer bonding processes. With its unique ability to be non-destructive, highly sensitive, and able to see through internal interfaces, it provides engineers with a "X-ray vision" of bonding interface quality, and is one of the key technologies to ensure wafer bonding yield, improve device reliability, and promote the development of 3D integration technology.

      Core parameters

      project parameter
      wafer size range 8′, 12′ Wafer (thickness: 60-3000 um)
      Probe configuration Single probe, dual probe, quad probe
      Ultrasonic transducer compatibility range 1~500MHz
      X/Y scan range, repeatability 420mmx320mm（Max），±0.5um 
      Maximum scan rate 1500mm/s
      Sampling rate 1-5G/s optional
      probe frequency 5-230MHz optional
      Highest scanning accuracy 1um/Pixel
      Scan platform structure Marble platform + gantry dual-drive linear motor
      Cleanliness level Class 100
      Software Analysis System Our self-developed NDTS system has AI-powered automatic defect identification capabilities.
      Equipment size 2000 x 2200 x 2200mm

      Product details display

      1

      Main components

      composition illustrate
      EFEM system • Matches dual loader ports, edge finders, and dual-arm robotic arms for stable wafer handling.
      • Achieves high automation; the standard EFEM system is stable and reliable; optional support for E84 overhead crane docking.
      Sports testing platform • The marble platform vibration damping device effectively prevents vibration during the testing process.
      • High resolution (0.1µm), high repeatability (±0.5µm), high speed (1500mm/s) operation control
      Ultrasonic scanning system • Equipped with an ultrasonic generator (500MHz), an ultrasonic probe (230MHz), and a data acquisition card (2G/s).
      • Equipped with the fully self-developed NDTS ultrasonic scanning analysis software, it effectively detects anomalies such as voids, delamination, and foreign objects inside the wafer.
      Wafer Inspection Data Management • Integrates wafer management functions, supporting real-time dynamic defect and yield management of wafers.
      • Supports the semiconductor industry standard SECS protocol, allows for customized reports, and integrates with client MES systems.

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