The equipment uses a single grinding spindle and a single wafer stage, and can automatically grind wafers by manually loading and unloading them.
Principle: The high-speed rotating spindle drives the grinding wheel to grind the wafers that are vacuum-adsorbed on the wafer carrier stage.
Components: Main unit, grinding spindle, Z-axis motion unit, stage, Y-axis worktable, measurement module, system protection module, control module, etc.
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