Semiconductors | Guanglinda Achieves Multiple Technological Breakthroughs in its Fully Automated Ultrasonic Scanning Equipment, Adopting a Dual-Line Approach to IGBT and SiC Technology

my country's new energy vehicle market is currently in a phase of exponential expansion.On November 16th of this year, BYD's 3 millionth new energy vehicle rolled off the production line. It took BYD 13 years to go from its first new energy vehicle to its 1 millionth; from its 2 millionth to its 3 millionth, it only took half a year. Statistics show that from January to September 2022, my country's new energy passenger vehicle market sold 4.351 million units, with a market penetration rate as high as 25.7%, demonstrating the unstoppable growth momentum of the new energy vehicle market.

IGBT module (Image source: Fuji Electric)

At the same time, the market has also placed higher demands on the reliability of semiconductor devices.With demand in the new energy vehicle market far exceeding expectations, the demand for automotive-grade IGBT/SiC semiconductor devices is soaring, and both domestic and international IGBT/SiC supplies are falling short of demand.Since defects such as voids, cracks, and delamination in the solder layer can cause semiconductor devices to fail during long-term operation, packaging reliability testing is of great significance for the industrialization of IGBT/SiC power modules, and internal defect testing is gradually moving from sampling inspection to full inspection.

In response to this issue, Suzhou Guanglinda Electronic Technology Co., Ltd. has launched...China's first fully automated ultrasonic scanning deviceThis device utilizes the different acoustic impedances of different materials to ultrasonic waves, resulting in varying degrees of absorption and reflection, to detect the internal structure and defects of samples, as well as to perform qualitative analysis. Without damaging the sample, its usability and quality can be assessed.

Multiple technological breakthroughs

By adopting a streamlined material loading and unloading method, the upstream and downstream processes are seamlessly connected, saving labor costs.

It adopts dual probes for simultaneous scanning, which improves production efficiency, with a UPH of over 120, making it suitable for mass production.

Equipped with a sealing clamp, water spraying can prevent the formation of air bubbles; after scanning, hot air drying ensures stability and reliability.

Our self-developed software features automatic NG (Not Found) detection and can be customized to meet customer needs.

On the customer side, the product has performed exceptionally well, and its ability to identify defects in discrete devices (IGBT/SiC) has been widely recognized by customers.To date, Guanglinda has partnered with dozens of well-known manufacturers in the industry, won bids for dozens of automatic oversweeping equipment lines, and undertaken key projects worth tens of millions of yuan. The initial spark has become a prairie fire.

Scan images of various electronic components

In the future, Guanglinda will expand its industrial layout in the semiconductor field, actively exchange and cooperate with industry peers, and contribute to the development of my country's semiconductor industry.