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On the second day of the second lunar month, the dragon raises its head, bringing good news and welcoming spring. Guanglinda achieves outstanding results in multiple fields.

2023-02-23

On the second day of the second lunar month, the dragon raises its head. Guanglinda's display and semiconductor divisions are reporting frequent successes. Building on past achievements and forging ahead, they are riding the waves to create even greater glories.

Breakthrough! Semiconductor industry secures multi-million dollar order from leading company.

Guanglinda has won a multi-million yuan order for ultrasonic scanning equipment from a leading company, encompassing more than ten automated semiconductor production lines. This signifies that Guanglinda's ultrasonic scanning equipment has reached a level of stable, large-scale application. This product marks the first time that fully automated ultrasonic testing equipment for power IGBT devices has been domestically produced, playing a significant role in enhancing the core competitiveness of advanced domestically packaged chips.

Full range! Dual-head, dual-station ultrascanning equipment introduced to mass production lines.

The GRD-CS502, part of the CS series of ultrasonic scanning equipment, has recently been recognized by a major customer in the ceramic copper-clad laminate industry and has been implemented in their mass production line. This equipment employs a dual-probe mode, significantly improving scanning efficiency compared to a manual single-station standard machine, making it highly practical for applications requiring full inspection of large batches of products.

New product! Submicron-level hot press bonding machine wins bid.

Guanglinda Semiconductor Business Unit offers a range of products including wafer grinding, spin coating and developing, and die mounting, covering crucial stages from semiconductor manufacturing to packaging and testing. Guanglinda's submicron-level hot-press die mounting equipment won a key project. This equipment enables chip-level mounting of high-power silicon carbide electronic chips, high-power semiconductor lasers, and other advanced devices, making it an indispensable piece of the puzzle in high-end chip packaging processes.

Another strong push! Securing orders worth tens of millions for Demura and OTP.

At the start of the new year, Guanglinda signed a multi-million dollar order for Demura and OTP equipment with a strategic partner, marking a significant milestone for 2023. Guanglinda has been deeply involved in the panel display field for ten years, accumulating rich experience and achieving remarkable results. In the new year, Guanglinda will continue to maintain its leading position in the industry and develop more high-quality products.

New land! Construction of Guanglinda's new factory is about to begin.

Guanglinda has received approval for nearly 20 acres of industrial land, where it is expected to construct two multi-story factory buildings with a total construction area of ​​approximately 28,000 square meters. The construction of the new factory signifies that Guanglinda will possess more advanced and comprehensive R&D, production, and sales capabilities, enabling it to provide customers with better and more comprehensive customized services. This demonstrates Guanglinda's determination to reach new heights and achieve even greater success in the display and semiconductor fields.