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Live from CSPT 2025 | Guanglinda's fully automated wafer bonding ultrasonic scanning equipment WB400-A makes its debut!

2025-10-31

As autumn deepens, Huai'an gathers industry stars. From October 28th to 29th, the CSPT 2025 China Semiconductor Packaging and Testing Technology and Market Conference grandly opened, bringing together industry elites to jointly draw a new blueprint for the development of packaging and testing. At this industry event, Suzhou Guanglinda Electronics Technology Co., Ltd. (Booth number: A47A spectacular debut.

Live from the exhibition: Guanglinda equipment attracts crowds.

From the very beginning of the exhibition, Guanglinda's meticulously arranged booth A47 attracted customers, partners, and industry experts from all over the country. This time, we mainly showcased...Ultrasonic scanning equipment for packaged devices, fully automated ultrasonic scanning equipment for wafer bonding, and wafer thinning equipment.The continuous demonstrations and detailed explanations created a professional and focused atmosphere throughout the booth, fully demonstrating the industry's high level of attention to advanced packaging and testing technologies and equipment.

Featured Product: WB400-A Fully Automated Wafer Bonding Ultrasonic Scanning Equipment

The WB400-A fully automated wafer bonding ultrasonic scanning equipment is used for 8/12-inch wafer inspection. It integrates the EFEM wafer loading and unloading system, motion scanning platform, ultrasonic scanning system, and nitrogen drying system to achieve integrated fully automated wafer inspection and ultrasonic scanning testing.

Ultrasonic scanning is an indispensable quality control tool in wafer bonding processes. With its unique ability to be non-destructive, highly sensitive, and able to see through internal interfaces, it provides engineers with a "X-ray vision" of bonding interface quality, and is one of the key technologies to ensure wafer bonding yield, improve device reliability, and promote the development of 3D integration technology.

Strength Builds Trust: Suzhou Guanglinda Electronic Technology Co., Ltd.

The popularity of the booth stems from the company's strong foundation. Suzhou Guanglinda Electronic Technology Co., Ltd. is a provider of testing and intelligent equipment systems specializing in optoelectronic displays and semiconductor packaging and testing.

Strong foundation in hardware:The company occupies 20 acres of land, with an 8,000㎡ self-funded R&D building and a 20,000㎡ self-owned automated production and assembly workshop. In 2020, the company established a high-end semiconductor equipment R&D center in Beijing, ensuring full control over the entire process from R&D to manufacturing.。

Self-developed technology:Guanglinda's semiconductor products serve industry leaders such as BYD, CRRC, Silan Microelectronics, and Huatian Semiconductor. Whether in software systems or automation, Guanglinda insists on independent research and development to ensure core...

Comprehensive services:We have offices in East China (Suzhou), South China (Shenzhen), Central China (Wuhan), Southwest China (Chengdu), and North China (Beijing) to provide timely and comprehensive technical support and services to our customers.

We look forward to meeting you at booth A47 to demonstrate equipment performance, exchange technical details, and jointly explore the development trends and innovative applications of semiconductor packaging and testing technology.

Let's work together, pool our resources, and live up to our potential! Let's join hands to propel China's semiconductor industry to new heights!