Green Energy in Kuala Lumpur, Exploring the Future of Chips | Guanglinda Invites You to SEMICON SEA 2026!

When Suzhou's precision manufacturing meets Kuala Lumpur's innovative vitality, a dialogue about the future of "chips" has begun.

From May 5th to 7th, 2026, SEMICON SEA, the Southeast Asia Semiconductor Exhibition, was grandly opened at the Malaysia International Trade and Exhibition Centre (MITEC) in Kuala Lumpur. Guanglinda, along with...CS3 Ultrasonic Scanning EquipmentandWB400-A Fully Automated Wafer Bonding Ultrasonic Scanning EquipmentTwo cutting-edge pieces of equipment were showcased at the exhibition. The booth was bustling with visitors, professional attendees flocked to it, and the atmosphere for technical exchanges was lively.

The GRD-CS3 ultrasonic scanning equipment is a non-destructive testing tool that displays waveforms and graphics. It is primarily used for wafer bonding inspection, advanced chip packaging, and optical module manufacturing processes. Utilizing high-frequency ultrasonic waves, it inspects various semiconductor devices and materials, detecting defects such as pores, cracks, inclusions, and delamination within the sample and displaying them graphically. The scanning process does not damage the sample and does not affect its performance.

During the live demonstration, its high-precision "see-through" capability revealed the internal layers and voids of the chip. Many customers stopped to watch and highly praised its stable imaging quality.

The WB400-A fully automated wafer bonding ultrasonic scanning equipment is used for 6/8/12-inch wafer inspection. It integrates the EFEM wafer loading and unloading system, motion scanning platform, ultrasonic scanning system, and nitrogen drying system to achieve integrated fully automated wafer inspection and ultrasonic scanning testing.

Ultrasonic scanning is an indispensable quality control tool in wafer bonding processes. With its unique ability to be non-destructive, highly sensitive, and able to see through internal interfaces, it provides engineers with a "X-ray vision" of bonding interface quality. It is one of the key technologies for ensuring wafer bonding yield, improving device reliability, and promoting the development of 3D integration technology.

Suzhou Guanglinda Electronic Technology Co., Ltd. is a provider of testing and intelligent equipment systems specializing in optoelectronic displays and semiconductor packaging and testing.