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Guanglinda showcased its products at SEMICON SEA, the Southeast Asian semiconductor exhibition.CS3 Ultrasonic Scanning EquipmentandWB400-A Fully Automated Wafer Bonding Ultrasonic Scanning EquipmentTwo cutting-edge pieces of equipment were showcased at the exhibition.

As autumn deepens, Huai'an gathers industry stars. From October 28th to 29th, the CSPT 2025 China Semiconductor Packaging and Testing Technology and Market Conference grandly opened, bringing together industry elites to jointly draw a new blueprint for the development of packaging and testing. At this industry event, Suzhou Guanglinda Electronics Technology Co., Ltd. (Booth number: A47A spectacular debut.

Market demand is the starting gun. Since last year, Guanglinda's CS1 ultrasonic testing equipment has been adopted in batches by several leading domestic customers in the AI ​​computing power-liquid cooling plate industry.Continuous and stable shipmentsWith its market-proven reliable performance, it has won the long-term trust of benchmark customers.

On March 22, 2025, Suzhou Guanglinda Electronic Technology Co., Ltd. and Xitai Technology (Meishan) Co., Ltd. joined hands to create an industry milestone.The first Micro OLED full-process testing production lineOfficially delivered!

April 6, 2023Suzhou Guanglinda Electronics Technology Co., Ltd.'s new production project for display and semiconductor testing equipmentThe groundbreaking ceremony was officially held. Government leaders, industry experts, and friends from all walks of life were invited to the event. Wang Bin, member of the Party Committee and Deputy Mayor of Huangdai Town, Xiangcheng District; Liang Xianguang, Chairman of Guanglinda; Ye Lezhi, Deputy Secretary-General of the China Electronic Special Equipment Industry Association; and Zhang Ting, Director of the Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, attended the ceremony and delivered speeches. Xia Zhaoyun, Secretary of the Party Committee of Huangdai Town; Lü Lei, member of the Party Committee of Huangdai Town; and Huang Xuefen, Deputy Mayor of Huangdai Town, also attended the ceremony.

On the second day of the second lunar month, the dragon raises its head. Guanglinda's display and semiconductor divisions are reporting frequent successes. Building on past achievements and forging ahead, they are riding the waves to create even greater glories.

Recently, Suzhou Guanglinda Electronic Technology Co., Ltd. (hereinafter referred to as "Guanglinda") won a large order worth tens of millions of yuan for ultrasonic scanning equipment from a leading company. The order includes more than ten semiconductor automated production lines, marking that Guanglinda's ultrasonic scanning equipment has reached the level of stable mass application.

my country's new energy vehicle market is currently in a phase of exponential expansion.On November 16th of this year, BYD's 3 millionth new energy vehicle rolled off the production line. It took BYD 13 years to go from its first new energy vehicle to its 1 millionth; from its 2 millionth to its 3 millionth, it only took half a year. Statistics show that from January to September 2022, my country's new energy passenger vehicle market sold 4.351 million units, with a market penetration rate as high as 25.7%, demonstrating the unstoppable growth momentum of the new energy vehicle market.

Guanglinda Semiconductor Division achieved another outstanding result in the third quarter of 2022. Today, another ultrasonic scanning device (GRD-CS3) was shipped to Yancheng, Jiangsu. To date, Guanglinda Semiconductor Division has established a nationwide sales network, with its business covering dozens of provinces and cities across the country.

With the continuous development of the semiconductor industry, the requirements for semiconductor device manufacturing processes are becoming increasingly stringent. Since defects such as solder layer voids, cracks, and delamination can lead to the failure of semiconductor devices during long-term operation, the market urgently needs a high-resolution, high-sensitivity, and highly sensitive non-destructive testing tool for bonded surfaces. Therefore, ultrasonic scanning technology has been introduced into semiconductor device manufacturing lines. At the 13th Semiconductor Discrete Device Annual Conference and Suzhou Third-Generation Semiconductor Industry Integration and Innovation Development Summit Forum, the General Manager of the Semiconductor Business Unit of Suzhou Guanglinda Electronics Technology Co., Ltd. delivered a speech entitled...Key Technologies and Localization of Ultrasonic Scanning Equipment for Semiconductor ChipsThe following is the core content of the speech.