Advantageous products

This is an integrated inspection device for 8/12-inch Micro LED/OLED wafer illumination AOI inspection, combining a self-developed EFEM wafer loading and unloading system, motion platform, probe card module, signal output from a signal transmitter, a spectrometer, and AOI inspection functions. It performs illumination inspection and screening of Micro OLED wafers before dicing.

It primarily drives hard and flexible AMOLED panels with various interfaces for module testing and system integration.

The CA-527 is a high-performance color analyzer integrating four core advantages, specifically designed to meet the precision measurement needs of modern display technologies such as OLED and Micro LED. It significantly expands the brightness measurement range and achieves extremely fast measurement compared to traditional models. The instrument also features an adjustable sampling frequency of up to 200kHz, enabling accurate capture of rapidly changing complex waveforms. The CA-527 introduces VRR (Flicker Rate) measurement functionality, effectively evaluating the non-periodic flicker unique to variable refresh rate displays. Coupled with convenient CA-S40 software support, it provides a highly reliable integrated solution for display device R&D, quality testing, and certification.

GAMMA TUNING SYSTEM 是An automated adjustment and programming system integrating a high-precision professional signal generator, standard optical measuring instruments, automatic/semi-automatic fixtures, and control adjustment software. Specifically designed for AMOLED gamma tuning and automated programming.

AOT automated optical inspection equipment is used for optical performance testing of Micro LED/OLED modules. It integrates an automated tray loading and unloading structure, and performs comprehensive optical performance testing including product brightness and color uniformity, CRA testing, and CIE testing. It is used to screen and evaluate the final optical performance of Micro LED/OLED modules.

The WB400-A is used for 6/8/12-inch wafer inspection, integrating an EFEM wafer loading and unloading system, a motion scanning platform, an ultrasonic scanning system, and a nitrogen drying system to achieve integrated, fully automated ultrasonic scanning testing for wafer inspection.
Ultrasonic scanning is an indispensable quality control tool in wafer bonding processes. With its unique ability to be non-destructive, highly sensitive, and able to see through internal interfaces, it provides engineers with a "X-ray vision" of bonding interface quality, and is one of the key technologies to ensure wafer bonding yield, improve device reliability, and promote the development of 3D integration technology.

GRD-The CS1 series ultrasonic scanning microscope is a highly practical non-destructive testing device launched by Guanglinda for the liquid cooling plate industry.This product primarily utilizes high-frequency ultrasound to scan the interior of water-cooled plates. It identifies and marks welding defects in the weld layer, such as incomplete penetration, porosity, cracks, poor brazing, and blockages in flow channels, which could lead to leaks or reduced heat dissipation efficiency. These defects are then presented graphically for easy identification and control. The scanning process does not damage the sample or affect its performance.

It is used for detecting uniform wall thickness reduction in ferromagnetic metal materials such as carbon steel and low alloy steel, and is also compatible with detecting uniform wall thickness reduction in non-ferromagnetic metal materials such as stainless steel and aluminum alloy. It can detect the wall thickness of large-wall-thickness structures with cladding layers.